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Engrich Solutions Sdn. Bhd. is the premier of industrial tooling solutions provider in the Asia Pacific region, serving with distinction the semiconductor, data storage, electronics and biomedical industry . Set up as design & marketing partner with GSH Technology Precision Sdn. Bhd.
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Wire Bond
The process of providing electrical connection between the silicon chip and the external leads of the semiconductor device using very fine bonding wires.
Die Attach
The process of attaching the silicon chip to the die pad or die cavity of the support structure (e.g., the leadframe) of the semiconductor package.
Others
View these technical resources to learn about flexible test system architectures that can help you achieve faster development, higher test throughput, and lower total cost.
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ENGRICH SOLUTIONS SDN.BHD.
35, JALAN SUNGAI TIRAM 2
TAMAN INDUSTRI NYAMAN MUTIARA 2
11900 BAYAN LEPAS
PULAU PINANG