Wire Bond

Wirebonding, or wire bonding, is the process of providing electrical connection between the silicon chip and the external leads of the semiconductor device using very fine bonding wires. The wire used in wirebonding is usually made either of gold (Au) or aluminum (Al), although Cu wirebonding is starting to gain a foothold in the semiconductor manufacturing industry. There are two common wirebonding processes: Au ball bonding and Al wedge bonding.

Heater Plate

Window Clamper

Heavy Wire Clamper

Anvil Block