Pick-and-place methods are also employed in die attach. This is the method of picking a die from a location and placing it in its desired location; doing so precisely using fiducial or other markings on the die, often in a + or x pattern. In certain cases with complex die attach, double pick-and-place is required. This furthers the accuracy of the placement, but on the downside decreases the throughput.
Die attach, also known as die bonding, is the process of attaching (or bonding) a die (or chip) to a substrate, package or another die. This process can take on many forms and can be applied in many different ways.